Dear Team,
i am working in BGA Component,BGA pitch is 0.65mm.BGA fantout is Via in Pad.in my design, i need to maintain copper widht is 3.6mil for plane layer under the BGA area.here i post the image file. Drill to drill need to maintain 7mil; trace to via clearance is 4mil;if 3.6mil running in between i can able to meet below image rules.but i need to assign the these rules for copper.if i flood the copper in under BGA area for below image rules copper is not flood between 2 holes or 2 vias.
contraint rules attached below
if i set the above rules copper to copper disconnected happened in between 2 holes or 2 vias.
The following queries are aries below.
1.why copper disconnected happen in inner layer.
2.is PADS software is not allowed below 5 mil copper widht ??
kindly update any one.it is very critical. Need to solve it ??
Reduce copper pour width.and grid.
Check Anti-pad size of the via.
Minimum requirement is 16 mil over the drill size.